型號(hào)	像元尺寸	像元數(shù)	像元中心距	響應(yīng)度-峰值	暗電流	帶寬	封裝類型	封裝	引腳數(shù)	窗口
ULMPIN-14-TT-N0112U	?55 μm	12 × 1	250 μm	0.6A/W	0.02 nA@-2V	12 GHz	Chip	Chip	-	-
ULMPIN-14-TT-N0104U	?55 μm	4 × 1	250 μm	0.6A/W	0.02 nA@-2V	12 GHz	Chip	Chip	-	-
ULMPIN-25-TT-N0112U	?42 μm	12 × 1	-	0.6A/W	0.2 nA@-2V	20 GHz	Chip	Chip	-	-
ULMPIN-25-TT-N0104U	?42 μm	4 × 1	-	0.6A/W	0.2 nA@-2V	20 GHz	Chip	Chip	-	-
ULMPIN-56-TT-N01012U	?39 μm	12 × 1	250 μm	0.6A/W	<0.1 nA@-2V	20 GHz	Chip	Chip	-	-
ULMPIN-56-TT-N0104U	?39 μm	4 × 1	250 μm	0.6A/W	<0.1 nA@-2V	20 GHz	Chip	Chip	-	-
FCI-GaAs-12M	?70 μm	12 × 1	250 μm	0.63A/W@850nm	0.03 nA@-5V	2.0 GHz	Chip	Ceramic Submount	-	-
ULMPIN-04-TN-U0112U	?100 μm	12 × 1	250 μm	0.5A/W	10 nA@-20V	4 GHz	Chip	Chip	-	-
ULMPIN-04-TN-U0104U	?100 μm	4 × 1	250 μm	0.5A/W	10 nA@-20V	4 GHz	Chip	Chip	-	-
ULMPIN-10-TT-N0112U	?70 μm	12 × 1	250 μm	0.6A/W	0.02 nA@-5V	8 GHz	Chip	Chip	-	-
ULMPIN-10-TT-N0104U	?70 μm	4 × 1	250 μm	0.6A/W	0.02 nA@-5V	8 GHz	Chip	Chip	-	-
FCI-GaAs-4M	?70 μm	4 × 1	250 μm	0.63A/W@850nm	0.03 nA@-5V	2.0 GHz	Chip	Ceramic Submount	-	-